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Collaboration with Siemens PLM Software for 3D Design Module

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Siemens LOI Signing

25 Sep 2017, ICDL Asia has successfully signed the Letter of Intent with Siemens PLM software and witnessed by Irish Minister Frances Fitzgerald at Fullerton Hotel in Singapore! And ICDL Asia is now an academic partner with Siemens PLM software in Asia. 

The Letter of Intent signifies the beginning of ICDL Asia and Siemens PLM Software to collaborate on a new 3D Design module, using Solid Edge from Siemens PLM, for the Asian market, primarily in China, India and Southeast Asia. The module will be mainly for Mechanical Design students from Polytechnics and Universities.  We believe that there will be a big demand in the education market from these Asian regions.

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